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Thank you for attending the IEEE FLEPS 2019. We look forward to seeing you in 2020! Stay tuned for the website link to go live. 

Conference Tutorials take place

July 7, 2019

Conference Takes Places

July 8, 2019

IEEE FLEPS Civic Reception

July 8, 2019

IEEE FLEPS 2019 Banquet Dinner

July 9, 2019

Congratulations to our 2019 Best Student Paper Award Winners!

 

1st Place Best Student Paper Award

to

Roslyn Massey, Evelyn Morin, Maria Derosa, Ravi Prakash

for the paper

“Label-Free Detection of Dopamine Using Aptamer Enhanced Organic-Electrolyte Gated FET Sensor”


2nd Place Best Student Paper Award

to

Habib Nassar, Abhilash Pullanchiyodan, Mitradip Bhattacharjee, Ravinder Dahiya

for the paper

“3D Printed Interconnects on Bendable Substrates for 3D Circuits”


3rd Place Best Student Paper Award

to

Mourad Elsobky, Alessandro Ottaviani, Mohammed Alomari, Zili Yu, Thomas Deuble, Joachim N. Burghartz

for the paper

“Characterization of Thin-Film Temperature Sensors and Ultra-Thin Chips for HySiF Integration”

 

FLEPS 2019 Keynote

SPEAKERS

The Conference will feature the following keynote speakers this year!

Learn more about this year's Keynote Speakers

Professor Arokia Nathan

Cambridge Touch Technologies, UK

Ultra Low Power Sensor Interfaces for IoT

Professor Takao Someya

University of Tokyo, Japan

Stretchable nanomesh electronics for wearables and in vitro characterizations

Corne Rentrop

Project Leader
Hybrid Printed Electronics Group at the Holst Center, TNO

Fundamentals and applications of hybrid printed Electronics and how to integrate into flexible, stretchable and three-dimensional products.